Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.
NSN 6135-01-054-2462
NSN 5915-00-679-9390
NSN 5999-00-139-6623
NSN 5950-01-370-0313
NSN 6240-01-589-7218
NSN 5985-00-105-7686
NSN 5925-01-431-7057
NSN 5910-01-165-2754
NSN 5999-01-131-2718
NSN 5945-01-546-2188
NSN 5999-01-147-8569
NSN 5895-01-188-7470
Last Updated: 11/21/2024