Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.
NSN 5930-01-488-6687
NSN 6650-00-105-8063
NSN 2925-00-412-2046
NSN 5915-01-410-2783
NSN 5855-01-418-6303
NSN 5960-00-834-4045
NSN 6145-01-182-3448
NSN 6650-01-140-4463
NSN 5975-01-541-7471
NSN 6145-01-092-5604
NSN 4140-01-519-1870
NSN 5945-01-113-4771
Last Updated: 05/14/2024