Board: glass epoxy (multilayer) type gf per mil-p-13949; printed circuitry shall be 2 oz copper; connector and terminal holes plated through, mil-std-275; solder coat all exposed copper surfaces and plated through holes, mil-std-275, followed by reflow; apply polymer shlder mask coating in selective areas to support marking requirements on component side (layer 1) and dip side (layer 4) conforming to ipc-sm-840, class 3, color green; fabricate per mil-p-55110.
NSN 5855-01-502-6414
NSN 6650-01-422-1037
NSN 5999-00-539-0904
NSN 5930-01-077-5568
NSN 5930-00-833-8458
NSN 6150-00-622-1320
NSN 6685-00-806-4009
NSN 5920-01-431-0429
NSN 5835-01-124-2942
NSN 5915-00-230-8803
NSN 6645-00-733-9341
NSN 5990-01-411-5930
Last Updated: 01/30/2025