Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 6610-01-340-1761
NSN 6220-00-872-1134
NSN 5950-01-494-3355
NSN 6610-01-382-4974
NSN 6220-01-421-4035
NSN 6220-01-582-8552
NSN 5998-00-109-7180
NSN 5996-01-631-5441
NSN 5990-01-312-2638
NSN 5985-01-020-7594
NSN 5835-01-034-1255
NSN 6620-01-097-1038
Last Updated: 03/01/2025