Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 6145-00-861-6035
NSN 5965-00-575-4089
NSN 6105-00-468-6323
NSN 5975-00-690-9061
NSN 7035-01-423-8343
NSN 6645-01-198-5785
NSN 5975-01-099-6418
NSN 6645-01-311-5481
NSN 6610-01-312-3032
NSN 6135-00-182-7008
NSN 6620-01-562-3862
NSN 6650-01-225-0176
Last Updated: 11/23/2024