Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 4140-01-193-8102
NSN 5950-01-432-9743
NSN 2925-01-180-7793
NSN 6135-00-485-7402
NSN 5920-01-129-9724
NSN 5996-01-249-7392
NSN 6110-00-770-2625
NSN 6145-01-563-3105
NSN 6105-01-322-4613
NSN 6145-01-359-2378
NSN 5910-00-203-5373
NSN 6145-00-656-5329
Last Updated: 05/07/2024