Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 5935-01-604-0120
NSN 5920-01-326-6143
NSN 5910-01-168-9440
NSN 2925-01-262-1418
NSN 5855-00-610-4052
NSN 6220-01-302-2214
NSN 5990-00-056-7815
NSN 5930-01-279-2997
NSN 5999-01-256-4682
NSN 6620-01-631-8889
NSN 6240-00-489-8531
NSN 6650-00-146-6485
Last Updated: 01/30/2025