Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 5905-01-573-2782
NSN 6645-00-033-8714
NSN 5996-01-278-9294
NSN 6130-00-406-0447
NSN 6240-00-569-5854
NSN 5965-01-313-9762
NSN 5945-00-267-3036
NSN 5999-00-959-4415
NSN 5895-00-288-5878
NSN 5999-01-272-8968
NSN 5915-00-423-2749
NSN 6150-00-144-7115
Last Updated: 12/25/2024