Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 6650-01-382-3216
NSN 2925-00-831-7024
NSN 5925-01-291-2828
NSN 5895-00-518-1593
NSN 6645-01-308-5729
NSN 5905-00-603-6481
NSN 5998-01-142-9787
NSN 5999-01-179-4731
NSN 5975-01-652-0723
NSN 6150-01-179-4278
NSN 5975-01-025-3602
NSN 5960-01-026-6199
Last Updated: 04/29/2024