Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 5855-01-651-9576
NSN 5910-01-013-8957
NSN 4140-01-586-2210
NSN 5910-01-003-9668
NSN 5920-01-579-5005
NSN 5835-01-031-7265
NSN 5950-01-153-0668
NSN 5950-00-219-6745
NSN 5996-00-417-4349
NSN 5960-01-245-6088
NSN 6240-01-013-8895
NSN 7035-01-247-6256
Last Updated: 02/17/2025