Assembly to meet requirements of specification 01417-sc-x15451 and to be manufactured in accordance with process specification 11655194; highest component not to exceed .62 from board surface; major components: board printed circuit 4; capacitor no. 2 1; capacitor no. 3 1; connector 4; semiconductor device diode no. 5 1; semiconductor device diode no. 6 23; semiconductor device transistor 1; semiconductor device zener 2; microcircuit precision timer 1; pad no. 10 1; pad no. 11 1; relay no. 12 3; relay no. 13 2; resistor nos 14, 15, 16, 17 1 ea; rivet 2; spacer no. 19 3; spacer no. 20 2
NSN 6610-01-047-7245
NSN 6240-00-677-0305
NSN 5835-00-168-9623
NSN 5999-01-454-8240
NSN 6110-00-172-0200
NSN 5895-01-071-4441
NSN 6685-01-397-0117
NSN 5965-01-633-4899
NSN 5985-01-418-1721
NSN 5945-01-196-8585
NSN 5960-01-507-9112
NSN 6150-00-335-7189
Last Updated: 12/26/2024