Package body material, low stress injection molded plastic silica and silicon impregnated; leadframe plating, sn pb solder; msl rating, msl1 (1); storage temperature, -65 to positive 150 degrees c; operating temperature, -40 to positive 85 degrees c; notes, leadframe material-copper alloy; dimensions are in inches (millimeters); dimension does not include moldflash of 0.15mm per side; dimension does not include moldflash of 0.25mm per side; all ground leads must be soldered to pcb rf ground
A microcircuit whose output is a function of the input; that is, the output varies in a predetermined and essentially predictable manner from the input signal.
Classification: Electronic integrated circuits and microassembly parts
NSN 5935-01-562-9219
NSN 5905-01-435-5505
NSN 6145-01-024-9466
NSN 6645-01-449-1824
NSN 5960-01-353-5947
NSN 4140-00-283-6843
NSN 5950-00-964-7450
NSN 6135-00-120-1027
NSN 7035-01-243-8523
NSN 6685-00-130-8768
NSN 6145-01-606-9382
NSN 6145-01-521-1824