Package body material, low stress injection molded plastic silica and silicon impregnated; leadframe plating, sn pb solder; msl rating, msl1 (1); storage temperature, -65 to positive 150 degrees c; operating temperature, -40 to positive 85 degrees c; notes, leadframe material-copper alloy; dimensions are in inches (millimeters); dimension does not include moldflash of 0.15mm per side; dimension does not include moldflash of 0.25mm per side; all ground leads must be soldered to pcb rf ground
A microcircuit whose output is a function of the input; that is, the output varies in a predetermined and essentially predictable manner from the input signal.
Classification: Electronic integrated circuits and microassembly parts
NSN 5925-01-036-8617
NSN 5960-00-266-6741
NSN 6620-00-905-6590
NSN 6130-01-181-5475
NSN 6145-00-924-8017
NSN 5998-00-369-7285
NSN 6650-00-692-1541
NSN 5905-01-289-1165
NSN 5950-00-764-4589
NSN 5920-01-442-8998
NSN 5998-01-236-1450
NSN 5835-01-223-1790