1.375 in. Lg; 0.156 in. W; 0.406 in. H; 0.250 in. Max opening
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 5935-01-622-3168
NSN 4140-00-910-0295
NSN 5945-01-449-4995
NSN 5950-01-095-4086
NSN 5930-01-634-0659
NSN 5835-01-313-3375
NSN 6220-00-826-7002
NSN 2925-01-463-8856
NSN 5930-00-940-9133
NSN 5985-00-300-3970
NSN 5998-01-482-8426
NSN 2925-00-070-4576