1.375 in. Lg; 0.156 in. W; 0.406 in. H; 0.250 in. Max opening
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 6145-01-519-3783
NSN 5990-01-544-0364
NSN 5835-00-707-6266
NSN 4140-00-405-2192
NSN 6150-00-780-2997
NSN 5855-00-055-1579
NSN 5960-00-661-0477
NSN 5925-01-524-3486
NSN 6130-00-596-9565
NSN 5950-00-878-6459
NSN 5990-01-548-5979
NSN 5960-01-089-7174