2N3347

Unitized Semiconductor Devices

NSN 5961-00-007-7445

DEMIL

Shelf Life

UOM

NIIN

Demil:

Shelf Life:

N/A

UOM:

1 EA

NIIN:

000077445

Product Features

All transistor junction pattern arrangement: pnp

Product Technical Spec.

Inclosure Material:

Metal

Overall Length:

Between 0.240 inches and 0.260 inches

Terminal Length:

0.500 inches

Overall Diameter:

Between 0.335 inches and 0.370 inches

Component Name And Quantity:

2 transistor

Mounting Method:

Terminal

Terminal Circle Diameter:

0.200 inches

Semiconductor Material:

Silicon all transistor

Voltage Rating In Volts Per Characteristic:

45.0 breakdown voltage, collector-to-emitter, base open all transistor

Terminal Type And Quantity:

6 uninsulated wire lead

NSN:

5961-00-007-7445

Item Name:

Diode Matrix

Cage Code:

80131

Cross Referenced Parts

Part Number

Cage

RNCC

RNVC

RNAAC

Status

MSDS

SADC

Part Number:

RELEASE4671

Cage Code:

80131

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3347

Cage Code:

01295

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Number:

2N3347

Cage Code:

12040

RNCC:

RNVC:

RNAAC:

Status:

MSDS:

SADC:

Part Identification

INC

FIIG

Concept No.

App. Key

Cond. Code

Status

INC:

61962

FIIG:

A110A0

Concept No.:

App. Key:

Cond. Code:

Status:

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators

HMIC

PMIC

ESD/EMI

ENAC

MMAC

CRITL

HMIC:

PMIC:

ESD:

MMAC:

CRITL:

Packaging & Shipping

Est. Pack Size

Est. Pack Weight

Est. Item Weight

Est. Item Dim.

Pack Size:

Paclk Weight:

Item Weight:

Item Dim:

OPI

SPI No.

SPI Rev.

SPC Mkg.

LVL A

LVL B

OPI:

SPI No.:

SPI Rev.:

SPC Mkg:

LVL_A:

LVL_B:

Freight Classification

NMFC

UFC

LTL

LCL

WCC

TCC

SHC

ACC

NMFC:

063025

UFC:

34525

LTL:

RATING VARIABLE

LCL:

WCC:

72D

TCC:

SHC:

ACC:

Instruments/Radio

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Pricing & Availability

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Definition Definition of approved item name (AIN): "Diode Matrix"

Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see rectifier, semiconductor device. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see microcircuit (as modified). Excludes network (as modified); absorber, overvoltage; semiconductor device set; and semiconductor device assembly. Do not use if more specific name applies.