93529

Memory Microcircuit

NSN 5962-00-361-8582

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
003618582

Technical Specifications of NSN

Body Length:
0.800 inches
Body Width:
0.265 inches
Body Height:
0.160 inches
Maximum Power Dissipation Rating:
600.0 milliwatts
Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Storage Tempurature Range:
-65.0/+150.0 degrees celsius
Features Provided:
Monolithic and hermetically sealed and negative outputs and positive outputs and w/buffered output and w/decoded output and true/complementary and high speed and low power
Inclosure Material:
Ceramic and glass
Inclosure Configuration:
Dual-in-line
Output Logic Form:
P-type metal oxide-semiconductor logic
Input Circuit Pattern:
11 input
Terminal Surface Treatment:
Solder
Voltage Rating And Type Per Characteristic:
0.3 volts power source and -15.0 volts power source
Memory Device Type:
Ram
Memory Capacity:
Unknown
Terminal Type And Quantity:
16 printed circuit
NSN:
5962-00-361-8582
Item Name:
Pal Assembly
Cage Code:
66696

Other Related Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
2501B
Cage Code:
18324
RNCC:
C
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
AF
Part Number:
2501N
Cage Code:
18324
RNCC:
C
RNVC:
1
RNAAC:
TX
Status:
A
MSDS:
SADC:
AF
Part Number:
MM4250D
Cage Code:
27014
RNCC:
3
RNVC:
2
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
M235A122-1
Cage Code:
09966
RNCC:
E
RNVC:
8
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
CM1101MDE
Cage Code:
12735
RNCC:
E
RNVC:
8
RNAAC:
TX
Status:
A
MSDS:
SADC:
Part Number:
IM7512MDE
Cage Code:
32293
RNCC:
5
RNVC:
9
RNAAC:
TX
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.2000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061700
UFC:
34580
LTL:
RATING VARIABLE
LCL:
77.5
WCC:
738
TCC:
Z
SHC:
9
ACC:
Instruments/Radio

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Pal Assembly"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
NATIONAL SECURITY AGENCY National Security Agency
DSOR:
User:
U.S. MARINE CORPS U.s. Marine Corps
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
FEDERAL AVIATION ADMINISTRATION Federal Aviation Administration
DSOR:
User:
AUSTRIA Austria
DSOR:
User:
SPAIN Spain
DSOR:
User:
REPUBLIC OF KOREA Republic of Korea
DSOR:
User:
NETHERLANDS Netherlands
DSOR:
User:
TURKEY Turkey
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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