CTJ-420E016-513

Semiconductor Device Assembly

NSN 5961-01-182-7636

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
N/A
UOM:
1 EA
NIIN:
011827636

Detail Specifications

Overall Length:
1.020 inches
Overall Height:
1.170 inches
Overall Width:
0.672 inches
Major Components:
Housing 1, diode 5
End Application:
Apache helicopter
NSN:
5961-01-182-7636
Item Name:
Array,subminiature Lamp
Cage Code:
11139

Manufacturer Part Numbers

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
HS4790-03
Cage Code:
8V613
RNCC:
3
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
JANTX1N3613
Cage Code:
81349
RNCC:
5
RNVC:
1
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
HS4790-3
Cage Code:
8V613
RNCC:
3
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
ADMS12-0002
Cage Code:
67720
RNCC:
5
RNVC:
2
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
HS4790-3
Cage Code:
02731
RNCC:
5
RNVC:
9
RNAAC:
ZZ
Status:
A
MSDS:
SADC:
Part Number:
HS4790-03
Cage Code:
02731
RNCC:
5
RNVC:
9
RNAAC:
BF
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
35565
FIIG:
T01200
Concept No.:
App. Key:
C
Cond. Code:
2
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
B
ESD:
B
MMAC:
EH
CRITL:
X

Packaging & Shipping

Est. Pack Size
Est. Pack Weight
Est. Item Weight
Est. Item Dim.
Pack Size:
--
Paclk Weight:
0.1000lbs
Item Weight:
--
Item Dim:
--
OPI
SPI No.
SPI Rev.
SPC Mkg.
LVL A
LVL B
OPI:
M
SPI No.:
SPI Rev.:
SPC Mkg:
ZZ
LVL_A:
Q
LVL_B:
Q

Freight Classification

NMFC
UFC
LTL
LCL
WCC
TCC
SHC
ACC
NMFC:
061260
UFC:
35180
LTL:
77.5
LCL:
77.5
WCC:
658
TCC:
3
SHC:
9
ACC:
Instruments/Radio

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Privacy | Terms

Definition Definition of approved item name (AIN): "Subminiature Lamp Array"

A grouping of two or more semiconducting devices such as light emitting diode; semiconductor device, diode; semiconductor device, photo; semiconductor device, thyristor; and/or transistor mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see rectifier, semiconductor device, unitized and semiconductor devices, unitized. Excludes semiconductor device set; microcircuit assembly; and microcircuit set. See also absorber, overvoltage.

MOE Major Organizational Entities

Entity
DSOR
User:
DEPARTMENT OF THE ARMY Dept. of the Army
DSOR:
User:
DEPARTMENT OF THE AIR FORCE Dept. of the Air Force
DSOR:
User:
DEPARTMENT OF THE NAVY Dept. of the Navy
DSOR:
User:
SPAIN Spain
DSOR:
User:
SINGAPORE Singapore
DSOR:
User:
AUSTRALIA Australia
DSOR:
User:
CANADA Canada
DSOR:
User:
REPUBLIC OF KOREA Republic of Korea
DSOR:
User:
UNITED KINGDOM United Kingdom
DSOR:
User:
NETHERLANDS Netherlands
DSOR:
User:
ITALY Italy
DSOR:
Import / Export
  • Schedule B: 8541500080
  • SITC: 77639
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Semiconductor devices, nesoi


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