Package body material, low stress injection molded plastic silica and silicon impregnated; leadframe plating, sn pb solder; msl rating, msl1 (1); storage temperature, -65 to positive 150 degrees c; operating temperature, -40 to positive 85 degrees c; notes, leadframe material-copper alloy; dimensions are in inches (millimeters); dimension does not include moldflash of 0.15mm per side; dimension does not include moldflash of 0.25mm per side; all ground leads must be soldered to pcb rf ground
A microcircuit whose output is a function of the input; that is, the output varies in a predetermined and essentially predictable manner from the input signal.
Classification: Electronic integrated circuits and microassembly parts
NSN 7035-01-656-5423
NSN 6110-01-037-9593
NSN 5985-00-542-0597
NSN 5990-00-226-7894
NSN 5895-01-254-2749
NSN 5960-01-305-5449
NSN 5905-01-461-8465
NSN 6150-00-982-0638
NSN 5915-00-583-4970
NSN 6650-00-155-8431
NSN 6105-01-499-8804
NSN 5855-00-832-9341