PL520D0100300160

Memory Microcircuit

NSN 5962-01-434-4562

DEMIL
Shelf Life
UOM
NIIN
Demil:
DEMIL/MLI
Shelf Life:
UOM:
NIIN:
014344562

Product Technical Spec.

Operating Tempurature Range:
-55.0/+125.0 degrees celsius
Inclosure Material:
Ceramic
Inclosure Configuration:
Dual-in-line
Output Logic Form:
Complementary-metal oxide-semiconductor logic
Voltage Rating And Type Per Characteristic:
5.0 volts power source
Memory Device Type:
Programmable
Terminal Type And Quantity:
24 pin
NSN:
5962-01-434-4562
Item Name:
Lan Bus Control Pal Device
Cage Code:
Z1F21

Cross Referenced Parts

Part Number
Cage
RNCC
RNVC
RNAAC
Status
MSDS
SADC
Part Number:
PL 520D01003001 ITEM 60
Cage Code:
Z1F21
RNCC:
5
RNVC:
2
RNAAC:
ZK
Status:
A
MSDS:
SADC:
Part Number:
EP600IDM883/B-55
Cage Code:
67183
RNCC:
3
RNVC:
9
RNAAC:
9Z
Status:
A
MSDS:
SADC:
Part Number:
PL 520D01003001 ITEM 60
Cage Code:
S7669
RNCC:
5
RNVC:
9
RNAAC:
ZK
Status:
A
MSDS:
SADC:
Part Number:
PL 520D01003001/60
Cage Code:
S7669
RNCC:
5
RNVC:
9
RNAAC:
ZK
Status:
A
MSDS:
SADC:

Part Identification

INC
FIIG
Concept No.
App. Key
Cond. Code
Status
INC:
41015
FIIG:
A458A0
Concept No.:
1
App. Key:
F
Cond. Code:
1
Status:
A

Part Materials

Hazardous material, precious metals, criticality, enviroment, and electrostatic discharge indicators
HMIC
PMIC
ESD/EMI
ENAC
MMAC
CRITL
HMIC:
N
PMIC:
A
ESD:
A
ESD:
A
MMAC:
CRITL:
X

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Pricing & Availability

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Privacy | Terms

Definition Definition of approved item name (AIN): "Lan Bus Control Pal Device"

A circuit designed to store information and/or coded instructions for later use. Item has pins or other connections to install in a computer or computing device. does not include magnetic drums, tapes, punched cards or the like. for items that have portable type connections see memory, portable, solid state.

MOE Major Organizational Entities

Entity
DSOR
User:
UNITED KINGDOM United Kingdom
DSOR:
Import / Export
  • Schedule B: 8542900000
  • SITC: 77689
  • End Use: Semiconductors
  • NAICS: 334413
  • USDA: 1

Classification: Electronic integrated circuits and microassembly parts


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