Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 5925-01-495-3727
NSN 5915-01-653-6186
NSN 5910-01-519-0122
NSN 5998-01-459-3073
NSN 2925-00-468-5273
NSN 5990-01-360-0711
NSN 6240-01-548-2197
NSN 6110-00-257-5199
NSN 5975-00-948-3633
NSN 6320-00-593-0379
NSN 6150-00-321-6494
NSN 5996-00-900-4001