Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 5855-01-656-6808
NSN 2925-00-526-4541
NSN 5950-00-112-7200
NSN 6150-01-450-9608
NSN 6650-00-312-1200
NSN 5920-01-435-3862
NSN 5965-00-529-0602
NSN 6650-00-555-1061
NSN 6130-01-250-6206
NSN 6320-01-607-1491
NSN 5895-01-218-4463
NSN 6645-01-365-1511