Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 6685-01-441-7568
NSN 5990-01-447-7779
NSN 5930-00-958-0432
NSN 6135-01-359-0051
NSN 5960-01-654-4353
NSN 5935-00-132-4396
NSN 5905-01-080-0662
NSN 5935-01-494-8723
NSN 5960-00-997-7386
NSN 6620-01-293-6241
NSN 5960-01-467-7516
NSN 5985-01-568-1395