Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 5945-00-295-6773
NSN 5965-01-277-1648
NSN 6320-00-459-8973
NSN 6240-00-849-5026
NSN 4140-01-367-5100
NSN 6685-01-155-9389
NSN 5935-01-342-3994
NSN 5990-01-312-2638
NSN 5905-01-555-8077
NSN 2925-01-113-6904
NSN 5965-01-633-8849
NSN 6320-01-291-4870