Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 5910-01-014-5488
NSN 5910-01-114-8454
NSN 5965-01-221-0569
NSN 5925-00-493-1881
NSN 5996-01-191-8758
NSN 5998-01-534-1725
NSN 5965-00-716-7078
NSN 6240-01-420-5905
NSN 6110-00-934-7943
NSN 6620-01-232-8552
NSN 6220-01-260-3734
NSN 6145-00-141-8095