Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 4140-01-302-9015
NSN 5990-01-074-5562
NSN 6110-00-663-4054
NSN 6650-01-378-6868
NSN 4140-01-015-5137
NSN 5985-01-423-3171
NSN 5965-00-420-5653
NSN 6320-01-486-8004
NSN 5915-01-502-6623
NSN 5920-01-543-8585
NSN 5915-00-054-6637
NSN 6320-01-627-1594