Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 5996-01-494-4122
NSN 6645-01-442-4032
NSN 6220-00-433-9337
NSN 5915-01-204-5833
NSN 6620-01-525-5914
NSN 5855-00-089-3974
NSN 5930-00-121-2273
NSN 6135-00-284-1406
NSN 5950-01-141-4304
NSN 5895-01-533-0960
NSN 4140-01-040-1700
NSN 5950-01-328-1344