Copper and tellurium; 1.437 in. Lg; 0.500 in. Hg
An item for dissipating heat during soldering operations which incorporates either a liquid absorbent in the form of foam or gel, or a metallic absorbent. The metallic absorbent is designed for attachment to heat sensitive components, such as diodes or transistors, to prevent thermal changes. Excludes heat sink, electrical-electronic components.
Classification: Parts of hand-directed or controlled machinery and apparatus for soldering, brazing, welding or surface tempering, other than those of heading 8515
NSN 6145-00-082-1906
NSN 5910-01-102-9853
NSN 5925-00-079-2930
NSN 5910-01-620-3237
NSN 5996-00-481-3930
NSN 5895-00-173-6021
NSN 6240-00-079-1759
NSN 5998-00-225-8522
NSN 5895-01-634-0630
NSN 6105-00-101-7747
NSN 5925-01-088-2837
NSN 6650-01-571-9386